ligitek electronics co.,ltd. property of ligitek only durl color led lamps lead-free parts LURF9UG3392-PF data sheet pb doc. no : qw0905-LURF9UG3392-PF rev. : a date : 15 - may - 2007
page 1/6 ligitek electronics co.,ltd. property of ligitek only 5.0 5.9 7.6 8.6 + 1 - 2 + 3 2.0min 2.54typ 1.anode green 2.common cathode 3.anode red 18.0min 9ug 10.5 0.5 urf part no. LURF9UG3392-PF package dimensions 0.5 typ 1 2 3 2.54typ 2.0min 1.5 max 30 0 100% 25%50% 0 25%75% 60 directivity radiation -30 100%75% -60 50% note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice.
* static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. 70 20 algainp ligitek electronics co.,ltd. property of ligitek only unit 9ug urf symbol parameter absolute maximum ratings absolute maximum ratings at ta=25 ma mw 60 130 75 120 a v 10 10 2000 i fp pd power dissipation peak forward current duty 1/10@10khz ir esd electrostatic discharge( * ) reverse current @5v forward current i f ma 30 50 page 2/6 -40 ~ +100 tstg storage temperature forward voltage @20ma(v) spectral halfwidth nm luminous intensity @20ma(mcd) color part nomaterial typical electrical & optical characteristics (ta=25 ) typ. 70 550 max.min. min. 350 2.4 201.5 1.72.6120220 lens emitted red white diffused LURF9UG3392-PF algainp green 630 574 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. dominant wave length dnm viewing angle 2 1/2 (deg) operating temperature -40 ~ +85 t opr part no. LURF9UG3392-PF
ligitek electronics co.,ltd. property of ligitek only typical electro-optical characteristics curve urf chip page 3/6 1.0 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 40 ambient temperature( ) 650700 550 600 wavelength (nm) ambient temperature( ) fig.5 relative intensity vs. wavelength 1.0 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a 0 0.9 0.8 -0 -40-202040 6080100 0 -40-20 0.5 -0206080100 fig.2 relative intensity vs. forward current forward current(ma) fig.4 relative intensity vs. temperature 3.0 f o r w a r d c u r r e n t ( m a ) forward voltage(v) fig.3 forward voltage vs. temperature 1.2 1.1 1.0 10 1.0 0.1 100 1.01.52.0 1.5 2.0 2.5 3.0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 3.0 2.5 1.0 1.0 0.5 0 10 2.0 1.5 2.5 fig.1 forward current vs. forward voltage 1000 3.5 1000 100 part no. LURF9UG3392-PF
fig.3 forward voltage vs. temperature ambient temperature( ) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0 0.5 2.03.04.05.0 0.8 40 -20 -4080100 60 0 0.5 1.0 1.5 2.0 0.9 1.2 1.0 1.1 1.0 1.5 2.0 2.5 2.5 3.0 20 0 20 -400 -2080 4060100 3.0 9ug chip wavelength (nm) r e l a t i v e i n t e n s i t y @ 2 0 m a 0 500 0.5 1.0 550 600 650 fig.5 relative intensity vs. wavelength page 4/6 part no. LURF9UG3392-PF
page 5/6 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only 150 time(sec) 260 c3sec max 260 temp( c) 2 /sec max 100 50 preheat 120 25 0 0 note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 5 /sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 60 seconds max part no. LURF9UG3392-PF
1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=230 5 2.dwell time=5 1sec solderability test high temperature high humidity test thermal shock test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 ligitek electronics co.,ltd. property of ligitek only description the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) high temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) reliability test: operating life test test condition test item mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard page 6/6 part no. LURF9UG3392-PF
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